Semiconductor packages with leadframes and related methods

ABSTRACT

Methods of forming a semiconductor package. Implementations include providing a leadframe, coupling a semiconductor die or an electronic component to the leadframe, and encapsulating at least a portion of the semiconductor die or the electronic component using a mold compound leaving two or more leads of the leadframe exposed. The method may also include coating the two or more leads of the leadframe with an electrically conductive layer. The method may include fully electrically and physically singulating one or more tie bars between two or more leads of the leadframe, a lead of the two or more leads and a leadframe flag, or any combination thereof. The method may also include singulating the leadframe to form one or more semiconductor packages.

CLAIM TO DOMESTIC PRIORITY

The present application is a continuation of U.S. patent applicationSer. No. 15/063,011, now U.S. Pat. No. 9,899,349, filed Mar. 7, 2016,which is a continuation-in-part of U.S. patent application Ser. No.14/168,850, now abandoned, filed Jan. 30, 2014, which is acontinuation-in-part of U.S. patent application Ser. No. 13/692,514, nowabandoned, filed Dec. 3, 2012, which is a continuation of U.S. patentapplication Ser. No. 13/190,922, now U.S. Pat. No. 8,324,026, filed Jul.26, 2011, which is a division of U.S. patent application Ser. No.12/362,142, now U.S. Pat. No. 8,071,427, filed Jan. 29, 2009, whichapplications are incorporated herein by reference.

FIELD OF THE INVENTION

Aspects of this document relate generally to semiconductor packages,such as for semiconductor die and other electronic components.

BACKGROUND

Semiconductor packages use leadframes to support a die or otherelectronic component. Various leadframe designs exist that form physicaland electrical connections between the semiconductor package and acircuit board to which the package is mounted. The die or otherelectronic component attached to the leadframe is most often fully orpartially encapsulated using a mold compound for protection fromhumidity and other environmental conditions.

BRIEF DESCRIPTION OF THE DRAWING

Implementations will hereinafter be described in conjunction with theappended drawings, where like designations denote like elements, and:

FIG. 1 is an isometric view of a first implementation of a semiconductorcomponent during manufacture;

FIG. 2 is an isometric view the semiconductor component of FIG. 1 at alater stage of manufacture;

FIG. 3 is a cross-sectional view of the semiconductor component of FIG.2 taken along section line 3-3 of FIG. 2;

FIG. 4 is a top view of a plurality of a second implementation ofsemiconductor components;

FIG. 5 is a bottom view of the plurality of semiconductor components ofFIG. 4 at a later stage of manufacture;

FIG. 6 is a cross-sectional view of the plurality of semiconductorcomponents of FIG. 5 taken along section line 6-6 at a later stage ofmanufacture;

FIG. 7 is a cross-sectional view of the plurality of semiconductorcomponents of FIG. 6 at a later stage of manufacture;

FIG. 8 is a cross-sectional view of the plurality of semiconductorcomponents of FIG. 7 at a later stage of manufacture;

FIG. 9 is a side view of the plurality of semiconductor components ofFIG. 8 at a later stage of manufacture;

FIG. 10 is a top view of another implementations of a plurality ofsemiconductor components during manufacture;

FIG. 11 is a cross-sectional view of the plurality of semiconductorcomponents of FIG. 10 taken along section line 11-11 at a later stage ofmanufacture;

FIG. 12 is a cross-sectional view of the plurality of semiconductorcomponents of FIG. 11 at a later stage of manufacture;

FIG. 13 is a cross-sectional view of the plurality of semiconductorcomponents of FIG. 12 at a later stage of manufacture;

FIG. 14 is a cross-sectional view of the plurality of semiconductorcomponents of FIG. 13 at a later stage of manufacture;

FIG. 15 is a top view of a plurality of semiconductor components duringmanufacture in accordance with another embodiment of the presentinvention;

FIG. 16 is a bottom view of the plurality of semiconductor components ofFIG. 15 at a later stage of manufacture;

FIG. 17 is a cross-sectional view of the plurality of semiconductorcomponents of FIG. 16 taken along section line 17-17 at a later stage ofmanufacture;

FIG. 18 is a cross-sectional view of the plurality of semiconductorcomponents of FIG. 17 at a later stage of manufacture;

FIG. 19 is a cross-sectional view of the plurality of semiconductorcomponents of FIG. 18 at a later stage of manufacture;

FIG. 20 is a side view of the plurality of semiconductor components ofFIG. 19 at a later stage of manufacture;

FIG. 21 is a cross-sectional view of another implementation of asemiconductor component;

FIG. 22 is an isometric view on another implementation of asemiconductor component during manufacture;

FIG. 23 is a cross-sectional view of the semiconductor component of FIG.22 taken along section line 23-23 of FIG. 22;

FIG. 24 is an isometric view the semiconductor component of FIG. 22 at alater stage of manufacture;

FIG. 25 is a cross-sectional view of the semiconductor component of FIG.24 taken along section line 25-25 of FIG. 24;

FIG. 26 is an isometric view of another implementation of asemiconductor component during manufacture;

FIG. 27 is a cross-sectional view of the semiconductor component of FIG.26 taken along section line 27-27 of FIG. 26;

FIG. 28 is an isometric view the semiconductor component of FIG. 26 at alater stage of manufacture;

FIG. 29 is a cross-sectional view of the semiconductor component of FIG.28 taken along section line 29-29 of FIG. 28;

FIG. 30 is an isometric view of another implementation of asemiconductor component during manufacture;

FIG. 31 is a cross-sectional view of the semiconductor component of FIG.30 taken along section line 31-31 of FIG. 30;

FIG. 32 is an isometric view the semiconductor component of FIG. 30 at alater stage of manufacture;

FIG. 33 is a cross-sectional view of the semiconductor component of FIG.32 taken along section line 33-33 of FIG. 32;

FIG. 34 is an isometric view of another implementation of asemiconductor component during manufacture;

FIG. 35 is a cross-sectional view of the semiconductor component of FIG.34 taken along section line 35-35 of FIG. 34;

FIG. 36 is an isometric view the semiconductor component of FIG. 34 at alater stage of manufacture;

FIG. 37 is a cross-sectional view of the semiconductor component of FIG.36 taken along section line 37-37 of FIG. 36;

FIG. 38 is an isometric view of another implementation of asemiconductor component during manufacture;

FIG. 39 is a cross-sectional view of the semiconductor component of FIG.38 taken along section line 39-39 of FIG. 38;

FIG. 40 is an isometric view the semiconductor component of FIG. 38 at alater stage of manufacture;

FIG. 41 is a cross-sectional view of the semiconductor component of FIG.40 taken along section line 41-41 of FIG. 40;

FIG. 42 is an isometric view of another implementation of asemiconductor component during manufacture;

FIG. 43 is a cross-sectional view of the semiconductor component of FIG.42 taken along section line 43-43 of FIG. 42;

FIG. 44A is a cross-sectional view of another implementation of asemiconductor component showing a saw blade;

FIG. 44B is a cross-sectional view of the implementation of FIG. 44Afollowing sawing;

FIG. 45A is a top view of a semiconductor package showing a fullthickness leadframe;

FIG. 45B is a cross-sectional view of the semiconductor package of FIG.45A taken along the sectional line A-A;

FIG. 45C is a cross-sectional view of the semiconductor package of FIG.45B following singulation;

FIG. 46A is a top view of the semiconductor package of FIG. 45A showingthe fully singulated leadframe;

FIG. 46B is a cross-sectional view of a half etched the semiconductorpackage;

FIG. 46C is a cross-sectional view of the semiconductor package of FIG.46B following singulation;

FIG. 47 is a top view of an implementation of a leadframe followingencapsulation;

FIG. 48 is a top view of the implementation of a leadframe of FIG. 47following singulation of the leads of the leadframe;

FIG. 49 is a top view of the implementation of the leadframe of FIG. 48following singulation of the tie bars of the leadframe between the leadsand the leadframe flags;

FIG. 50 is a top view of the implementation of the leadframe of FIG. 49following singulation of the leadframe to form a plurality ofsemiconductor packages;

FIGS. 51A and 51B illustrate implementations of leadframes with tie barsthat cannot be singulated using saw or high pressure water jetprocesses;

FIG. 52 is a top view of an implementation of a leadframe that can besingulation using a saw or high pressure water jet process;

FIGS. 53A and 53B show the leadframes of FIGS. 51A and 51B followingsingulation using a laser scribe or mask and etch process;

FIG. 54 is a top view of the implementation of FIG. 52 followingsingulation of the tie bars using a saw or high pressure water jetprocess;

FIGS. 55A and 55B are top views of implementations of leadframes whichcontain tie bars that are all a predetermined width;

FIG. 56 is a side view of a leadframe that has been encapsulated;

FIG. 57 is a side view of a leadframe with leads on two edges bentdownwardly via deflection;

FIG. 58 is a side view of a leadframe with leads on two edges benddownwardly via a formed bending process;

FIG. 59 is a top view of a leadframe implementation with tie bars thathave been partially singulated;

FIG. 60A is a cross-sectional view of a leadframe taken along sectionalline B-B in FIG. 59 either post partial singulation or half etched;

FIG. 60B is a cross-sectional view of the leadframe of FIG. 60Afollowing coating the leads with an electrically conductive layer; and

FIG. 61 is a cross-sectional view of the leadframe of FIG. 60B followingfull singulation of the tie bars.

DETAILED DESCRIPTION OF THE DRAWINGS

This disclosure, its aspects and implementations, are not limited to thespecific components, assembly procedures or method elements disclosedherein. Many additional components, assembly procedures and/or methodelements known in the art consistent with the intended semiconductorpackages and related methods will become apparent for use withparticular implementations from this disclosure. Accordingly, forexample, although particular implementations are disclosed, suchimplementations and implementing components may comprise any shape,size, style, type, model, version, measurement, concentration, material,quantity, method element, step, and/or the like as is known in the artfor such semiconductor packages and related methods, and implementingcomponents and methods, consistent with the intended operation andmethods.

FIG. 1 is an isometric view of an implementation semiconductor component10 during manufacture. What is shown in FIG. 1 are leadframe leads 12and a leadframe flag 14 of a leadframe 16 partially embedded in a moldcompound 18, which has sides 20 and 21 and edges or side surfaces 22.Leadframe leads 12 and leadframe flag 14 protrude or extend from side20. In particular implementations, lead frame 16 is made of copper.Other suitable materials for leadframe 16 include, by non-limitingexample, copper alloys, steel, iron, or the like. Leadframe leads 12 areshown as being rectangular cuboids having side surfaces 24 and endsurfaces 26 and 28. Leadframe flag 14 is a rectangular cuboid havingside surfaces 30, end surfaces 32, and extensions 34 extending from endsurfaces 32. The shapes of the leadframe flag and leadframe leads arenot limited to having a rectangular cuboid shape. Other shapes for theleadframe flag and leadframe leads include circular, oval, square,triangular, pentagonal, or any other geometric shape. Extensions 34 haveend surfaces 38. A layer of electrically conductive material 40 isformed over leadframe leads 12 and flag 14. Electrically conductivematerial 40 may be tin, lead, solder, a combination of tin and lead, orthe like. Electrically conductive material 40 is absent from endsurfaces 26 of leadframe leads 12 and end surfaces 38 of extensions 34.Thus, end surfaces 26 and 38 are exposed regions of leadframe leads 12.When leadframe 16 is copper, end surfaces 26 and 38 are exposed regionsof copper. By way of example, end surfaces 26 and 38 are exposed whensemiconductor components 10 are separated or singulated from a leadframestrip (not shown) and may be referred to as outer edges of the leadframelead.

Referring now to FIG. 2, an electrically conductive material 42 isformed on electrically conductive layer 40 and on end surfaces 26 and 38using, for example, an electroplating process such as a spouted bedelectroplating process or a vibratory plating process. The spouted bedelectroplating process may be performed in a spouted bed electroplatingdevice and the vibratory plating process may be performed in a vibratoryplating device. Electrically conductive material 42 may be referred toas vibratory plated material or the spouted bed electroplated materialwhen formed using a vibratory plating device or a spouted bedelectroplating device, respectively, and may be formed over more thanfifty percent and up to one hundred percent of the outer edge of theleast one of the plurality of leads. Layers 40 and 42 are furtherillustrated in FIG. 3. In in various implementations, the material ofelectrically conductive layer 42 is tin. Other suitable materials forelectrically conductive layer 42 include, by non-limiting example, lead;solder; a combination of tin and lead; silver; nickel; a combination ofnickel, lead, and gold; or the like. Similarly, other methods forforming electrically conductive layer 42 may be used in variousimplementations. Layer of electrically conductive material 42 may coveror partially cover surfaces 26 and 38. An advantage of forming layers ofelectrically conductive material 42 is that it may form a wettablematerial over surfaces 26 and 38.

FIG. 3 is a cross-sectional view of semiconductor component 10 takenalong section line 3-3 of FIG. 2. FIG. 3 further illustrates leadframeleads 12, flag 14, and electrically conductive layers 40 and 42. For thesake of completeness, a semiconductor chip 62 is shown as being mountedto leadframe flag 14 through a die attach material 63.

FIG. 4 is a top view of a portion of an electrically conductive support51 having device or component receiving areas 52, interconnectstructures 54, structural support members 56, 56A, and 57, and opposingsides 58 and 60 (opposing side 60 is illustrated in FIG. 5) used in themanufacture of semiconductor components 50 (shown in FIG. 9).Interconnect structures 54 are also referred to as electricalinterconnect structures or electrically conductive interconnectstructures. It should be noted that the term top view is used for thesake of clarity and to distinguish the side of electrically conductivesupport 51 to which one or more active circuit elements or one or morepassive circuit elements is mounted. In various implementations,electrically conductive support 51 is a leadframe, interconnectstructures 52 are flags, interconnect structures 54 are leadframe leads,support members 56 and 56A are tie bars, and support members 57 arerails. By way of example, semiconductor chips or dice/die 62 are coupledto side 58 of leadframe 51 through a die attach material 63 (shown inFIG. 6). More particularly, a semiconductor chip 62 is mounted to eachflag 52 through the die attach material. Semiconductor chips 62 havebond pads 66 that are coupled to corresponding leadframe leads 54through bond wires 68. Bond wires are also referred to as wirebonds.Many numbers of and arrangements of flags and leadframe leads and theirshapes may be used in various implementations. Although semiconductorchips 62 have been described as being mounted to flags 52, passivecircuit elements such as resistors, inductors, and capacitors as well asactive circuit elements such as semiconductor chips comprisingtransistors may be coupled to or mounted on leadframe 51 in place of orin addition to semiconductor chips 62 in various implementations.

Referring now to FIG. 5, a bottom view of a portion of leadframe 51after a mold compound 70 has been formed over semiconductor chips 62 andwirebonds 68 to form a molded leadframe strip 72 is shown. It should beunderstood that mold compound 70 is formed over side 58, i.e., the topside, leaving side 60 substantially free of mold compound and that FIG.5 is a bottom view of leadframe 51. It should be further understood thatreferring to the views shown in the figures as top views and bottomviews and the designation of a view as being a top view or a bottom viewis merely to facilitate describing various implementations. Broken lines79 indicate where portions of leadframe leads 54 will be separated andexposed. Broken lines 79 also indicate the regions in which tie bars 56are removed. Separating and exposing leadframe leads 54 and removing tiebars 56 are further described with reference to FIG. 7.

FIG. 6 is a cross-sectional view of molded leadframe strip 72 takenalong section line 6-6 of FIG. 5. FIG. 6 illustrates portions ofleadframe flags 52, leadframe leads 54, die attach material 63, andsemiconductor chips 62.

FIG. 7 is a cross-sectional view of molded leadframe strip 72 shown inFIG. 6 at a later stage of manufacture. What is shown in FIG. 7 isleadframe 51 after portions have been removed. More particularly,portions of leadframe leads 54 and tie bars 56 are removed to formcavities 76 having sidewalls 78. By way of example, the portions ofleadframe leads 54 and tie bars 56 are removed by partially sawing intoleadframe leads 54 and tie bars 56. Preferably, the thickness ofleadframe leads 54 and tie bars 56 that are removed ranges from about 50percent (%) to 100% of the thicknesses of leadframe leads 54 and tiebars 56. However, the thicknesses of leadframe leads 54 and tie bars 56that are removed may be less than 50% and equal to or greater than 100%of their thicknesses. In particular implementations, about three-fourthsof the thickness of leadframe leads 54 and tie bars 56 is removed.Suitable techniques for removing the portions of leadframe leads 54include sawing, cutting, etching, stamping, punching, or the like. Theregions at which the portions of leadframe leads 54 and tie bars 56 areremoved are shown in FIG. 5 and identified by broken lines 79.

Referring now to FIG. 8, a layer of electrically conductive material 80having a thickness ranging from about 0.5 microinches (12.7 nanometers)to about 3,000 microinches (76.2 micrometers) is formed on leadframeleads 54, including the portions of leadframe leads 54 within cavities76. In various implementations, electrically conductive material 80 istin formed by an electroplating process using a spouted bedelectroplating device or a vibratory plating device. Electricallyconductive material 80 may be referred to as vibratory plated materialor the spouted bed electroplated material when formed using a vibratoryplating device or a spouted bed electroplating device, respectively, andmay be formed over more than fifty percent and up to one hundred percentof an outer edge of the least one of the leadframe leads. The type ofelectrically conductive material for electrically conductive layer 80may include, by non-limiting example, silver; nickel; a combination ofnickel, lead, and gold; or the like. Similarly, the method for formingelectrically conductive layer 80 may be any disclosed in this document.

Although the examples for the material for electrically conductive layer80 have been metals, other materials may be used in variousimplementations. For example, layer 80 may be a conductive epoxy.Alternatively, an anti-oxidizing coating or agent may be formed overleadframe leads 54 and on the exposed portions of leadframe leads 54.These types of coatings are electrically non-conductive materials thatinhibit the oxidation of metals such as copper at room temperature.During the formation of solder over leadframe leads 54, theanti-oxidizing coating evaporates allowing solder to form on the exposedportions of leadframe leads 54. The anti-oxidizing coating leaves aclean wettable copper surface after it has evaporated to which soldercan adhere.

Referring now to FIG. 9, portions of leadframe leads 54 and tie bars 56remaining in cavities 76 are removed exposing sidewall portions 82 ofleadframe leads 54 and portions of mold compound 70, and singulatingmolded leadframe strip 72 into individual semiconductor components 50.In embodiments in which cavities 76 are formed using a sawing processand molded leadframe strip 72 is singulated using a sawing process,preferably the width of the saw blade used to singulate molded leadframestrip 72 is less than the width of the saw blade used to form cavities76. The remaining portions of electrically conductive layer 80 provide awettable material over portions of the surfaces of leadframe leads 54.

FIG. 10 is a top view of a leadframe 51 having flags 52, leadframe leads54, tie bars 56 and 56A, and opposing sides 58 and 60. Leadframe leads54 include of leadframe leads 54A-1, 54B-1, 54A-2, 54B-2, 54A-3, 54B-3,54A-4, and 54B-4, wherein leadframe leads 54A-1 and 54B-1 are ondirectly opposite sides of tie bars 56, leadframe leads 54A-2 and 54B-2are on directly opposite sides of tie bars 56, leadframe leads 54A-3 and54B-3 are on directly opposite sides of tie bars 56, and leadframe leads54A-4 and 54B-4 are on directly opposite sides of tie bars 56.Semiconductor chips or dice 62 are coupled to side 58 of leadframe 51through a die attach material 63. More particularly, a semiconductorchip 62 is mounted to each flag 52 through die attach material 63.Semiconductor chips 62 have bond pads 66 that are coupled tocorresponding leadframe leads 54 through bond wires 68. Bond wires arealso referred to as wirebonds. A wide number of flags 52 and leadframeleads 54 per leadframe may be used in various implementations.

Wirebonds 100-1, 100-2, 100-3, and 100-4 are formed to electricallycouple leadframe leads 54A-1, 54A-2, 54A-3, and 54A-4 with leadframeleads 54B-1, 54B-2, 54B-3, and 54B-4, respectively. Wirebonds 102 areformed to electrically couple leadframe leads 54A-1, 54A-2, 54A-3, and54A-4 to each other and wirebonds 104 are formed to electrically coupleleadframe leads 54A-1, 54A-2, 54A-3, 54A-4, 54B-1, 54B-2, 54B-3, and54B-4 to at least one of rails 57. Alternatively, wirebonds 102 can beformed to electrically couple leadframe leads 54B-1, 54B-2, 54B-3, and54B-4 to each other. Wirebonds 100-1, 100-2, 100-3, 100-4, 102, and 104form electrical connections between leadframe leads 54 and rails 57during the plating process. While the use of wirebonds for electricallyconnecting leadframe leads 54, tie bars 56, and rails 57 is illustrated,in other implementations, conductive clips may be used to electricallyconnect leadframe leads 54, tie bars 56, and rails 57.

Like semiconductor components 10 and 50, a mold compound 70 (shown inFIGS. 11-14) is formed over semiconductor chips 62 and wirebonds 68,100-1, 100-2, 100-3, 100-4, 102, and 104 to form a molded leadframestrip 72A (shown in FIGS. 11-13) that is similar to molded leadframestrip 72. It should be noted that a bottom view of a molded leadframestrip for semiconductor component 150 is similar to the bottom view ofmolded leadframe strip 72 shown in FIG. 5. A bottom view of the moldedleadframe strip is similar to the bottom view shown in FIG. 5. Asdescribed above, referring to the views shown in the figures as topviews and bottom views and the designation of a view as being a top viewor a bottom view is merely to facilitate describing the variousimplementations illustrated herein.

FIG. 11 is a cross-sectional view of molded leadframe strip 72A takenalong the region shown by section line 11-11 of FIG. 10 but at a laterstep than that shown in FIG. 10. FIG. 11 illustrates portions ofleadframe flags 52, leadframe leads 54, die attach material 63,semiconductor chips 62, and wirebonds 100-3.

FIG. 12 is a cross-sectional view of molded leadframe strip 72A shown inFIG. 11 but at a later stage of manufacture than the molded leadframestrip shown in FIG. 11. What is shown in FIG. 12 is molded leadframestrip 72A after portions of leadframe 51 and mold compound 70 have beenremoved. More particularly, portions of leadframe leads 54 and moldcompound 70 are removed to form cavities 76A having sidewalls 78A. Byway of example, the portions of leadframe leads 54 are removed by sawinginto leadframe leads 54, tie bars 56, and mold compound 70. The methodfor removing leadframe leads 54, tie bars 56 and mold compound 70 mayinclude sawing, cutting, etching, stamping, punching, or the like. Theregions at which the portions of leadframe leads 54, tie bars 56, andrails 57 are removed are identified by broken lines 79 shown in FIG. 10.

Referring now to FIG. 13, a layer of electrically conductive material 80having a thickness ranging from about 0.5 microinches (12.7 nanometers)to about 3,000 microinches (76.2 micrometers) is formed on leadframeleads 54, including the portions of leadframe leads 54 within cavities76A. In various implementations, electrically conductive material 80 istin formed by an electroplating process using a spouted bedelectroplating device or a vibratory plating device and may be formedover more than fifty percent and up to one hundred percent of an outeredge of the least one of the leadframe leads. Electrically conductivematerial 80 may be referred to as vibratory plated material or thespouted bed electroplated material when formed using a vibratory platingdevice or a spouted bed electroplating device, respectively, and may beformed over more than fifty percent and up to one hundred percent of anouter edge of the least one of the leadframe leads. The type ofelectrically conductive material and the method for forming theelectrically conductive material may be any disclosed in this document,including silver; nickel; a combination of nickel, lead, and gold; orthe like.

As discussed above, electrically conductive layer 80 may not be a metal,but can be a conductive epoxy or an anti-oxidizing coating or agentformed over leadframe leads 54 and on the exposed portions of leadframeleads 54. These types of coatings are electrically non-conductivematerials that inhibit the oxidation of metals such as copper at roomtemperature. During the formation of solder over leadframe leads 54, theanti-oxidizing coating evaporates allowing solder to form on the exposedportions of leadframe leads 54. The anti-oxidizing coating leaves aclean wettable copper surface after it has evaporated to which soldercan adhere.

Referring now to FIG. 14, portions of leadframe leads 54 and tie bars 56remaining in cavities 76A and portions of mold compound 70 are removedforming sidewalls from mold compound 70 and singulating molded leadframestrip 72A into individual semiconductor components 150, i.e., theportions of mold compound 70 exposed by removing the portions ofleadframe leads 54 and tie bars 56 are removed to singulate moldedleadframe strip 72A into individual semiconductor components 150. Inaddition, wire bonds 100-1, 100-2, 100-3, 100-4, 102, and 104 are cut,opened, or separated. It should be noted that in various implementationsin which wire bonds 102 and 104 are opened using a sawing or cuttingprocess, wire bonds 102 and 104 are cut in a direction substantiallyperpendicular to wire bonds 100-1, 100-2, 100-3, 100-4. The remainingportions of electrically conductive layer 80 provide a wettable materialover surfaces of leadframe leads 54.

FIG. 15 is a top view of a portion of a leadframe 51A having a flag 52,leadframe leads 54, tie bars 56 and 56A, rails 57, and opposing sides 58and 60 (opposing side 60 is illustrated in FIG. 16) used in themanufacture of semiconductor components 200 (shown in FIG. 20).Leadframe 51A is similar to leadframe 51 described with reference toFIG. 4 except that dimples 152 are formed in tie bars 56. Because ofthis difference, the reference character “A” has been appended toreference character 51. Dimples 152 may be formed by stamping the tiebars of leadframe 51A. The locations of dimples 152 are illustrated bybroken lines 154 in FIG. 14. Dimples 152 are shown in FIGS. 17-20.Semiconductor chips or dice 62 are coupled to side 58 of leadframe 51Aand bond pads 66 are coupled to corresponding leadframe leads 54 throughbond wires 68 as described with reference to FIG. 4. Alternatively andas discussed with reference to FIG. 3, passive circuit elements such asresistors, capacitors, and inductors or other active circuit elementsmay be coupled to or mounted on leadframe 51A in place of or in additionto semiconductor chips 62.

Referring now to FIG. 16, a bottom view of a portion of leadframe 51after a mold compound 70 has been formed over semiconductor chips 62 andwirebonds 68 to form a molded leadframe strip 72B is shown. Broken lines154 indicate where dimples 152 are formed in leadframe 51A. It should beunderstood that mold compound 70 is formed over side 58, i.e., the topside, leaving side 60 substantially free of mold compound and that FIG.16 is a bottom view of leadframe 51A. It should be further understoodthat referring to the views shown in the figures as top views and bottomviews and the designation of a view as being a top view or a bottom viewis merely to facilitate describing various implementations. Broken lines79 indicate where portions of leadframe leads 54 are separated andexposed. Broken lines 79 also indicate the regions in which tie bars 56are removed. The acts of separating and exposing leadframe leads 54 andremoving tie bars 56 are further described with reference to FIG. 18.

A mold compound 70 is formed over semiconductor chips 62 and wirebonds68 to form a molded leadframe strip 72B as described with reference toFIG. 5. Like FIG. 5, FIG. 16 is a bottom view of molded leadframe strip72B. The locations of dimples 152 are illustrated by broken lines 154.As discussed above, dimples 152 are shown with reference to FIGS. 17-20.Broken lines 79 indicate where portions or regions of leadframe leads 54are separated and exposed.

FIG. 17 is a cross-sectional view of molded leadframe strip 72B takenalong section line 17-17 of FIG. 16. FIG. 17 illustrates portions ofleadframe flags 52, leadframe leads 54, die attach material 63,semiconductor chips 62, and dimples 152.

FIG. 18 is a cross-sectional view of molded leadframe strip 72B shown inFIG. 17 at a later stage of manufacture. What is shown in FIG. 18 ismolded leadframe strip 72B after portions of leadframe 51A have beenremoved to form cavities 76C having sidewalls 78C. By way of example,the portions of leadframe leads 54 are removed by partially sawing intoleadframe leads 54 and tie bars 56. Preferably, the thicknesses ofleadframe leads 54 and tie bars 56 that are removed is less than about100% of the thickness of leadframe leads 54. In particularimplementations, about three-fourths of the thicknesses of leadframes 54and tie bars 56 are removed. Suitable techniques for removing theportions of leadframe leads 54 include sawing, cutting, etching,stamping, punching, or the like. The regions at which the portions ofleadframe leads 54, tie bars 56, and rails 57 are removed are identifiedby broken lines 79 shown in FIGS. 15 and 16.

Referring now to FIG. 19, a layer of electrically conductive material 80having a thickness ranging from about 0.5 microinches (12.7 nanometers)to about 3,000 microinches (76.2 micrometers) is formed on leadframeleads 54, including the portions of leadframe leads 54 within cavities76C. In particular implementations, electrically conductive material 80is tin formed by an electroplating process in a spouted beelectroplating device or a vibratory plating device. Electricallyconductive material 80 may be referred to as vibratory plated materialor the spouted bed electroplated material when formed using a vibratoryplating device or a spouted bed electroplating device, respectively, andmay be formed over more than fifty percent and up to one hundred percentof an outer edge of the least one of the leadframe leads. The type ofelectrically conductive material and the method for forming theelectrically conductive material may any disclosed in this documentincluding silver; nickel; a combination of nickel, lead, and gold; orthe like.

As discussed above, electrically conductive layer 80 may not be a metal,but can be a conductive epoxy or an anti-oxidizing coating or agentformed over leadframe leads 54 and on the exposed portions of leadframeleads 54. These types of coatings are electrically non-conductivematerials that inhibit the oxidation of metals such as copper at roomtemperature. During the formation of solder over leadframe leads 54, theanti-oxidizing coating evaporates allowing solder to form on the exposedportions of leadframe leads 54. The anti-oxidizing coating leaves aclean wettable copper surface after it has evaporated to which soldercan adhere.

Referring now to FIG. 20, portions of leadframe leads 54 and tie bars 56remaining in cavities 76C are removed exposing sidewall portions ofelectrically conductive layer 80, sidewall portions 82A of leadframeleads 54, and portions of mold compound 70, and singulating moldedleadframe strip 72B into individual semiconductor components 200. Inembodiments in which cavities 76C are formed using a sawing process andmolded leadframe strip 72B are singulated using a sawing process,preferably the width of the saw blade used to singulate molded leadframestrip 72B is less than the width of the saw blade used to form cavities76C. The remaining portions of electrically conductive layer 80 providea wettable material over surfaces of leadframe leads 54.

Referring now to FIG. 21, a cross-sectional view of a semiconductorcomponent 225 is illustrated. Semiconductor component 225 includes asemiconductor chip 228 having bond pads 230 mounted to leadframe leads232 and protected by a mold compound 70. A material 236 is formed onedges 234 of leadframe leads 232 that were exposed after singulation.Material 236 may be an electrically conductive material or ananti-oxidizing material. Although material 236 is shown as covering allof edges 234, material 236 may cover less than the entirety of edges 234in various implementations. It should be noted that flags are absentfrom component 225.

In accordance with another embodiment, a semiconductor component suchas, for example semiconductor component 10, 50, 150, 200, or 225, iswithin an engine compartment of an automobile.

FIG. 22 is an isometric view of another implementation of asemiconductor component 300 during manufacture. FIG. 23 is across-sectional view of semiconductor component 300 taken along sectionline 23-23 of FIG. 22. For the sake of clarity, FIGS. 22 and 23 will bedescribed together. FIGS. 22 and 23 illustrate a portion of anelectrically conductive support 302 that includes a device or componentreceiving structure 304 and interconnect structures 306 partiallyembedded in a mold compound 310. In various implementations,electrically conductive support 302 is a portion of a leadframe such as,for example, leadframe 51 described with reference to FIG. 4. Devicereceiving structure 304 has opposing major surfaces 304A and 304B andminor surfaces 304C, 304D, 304E, and 304F. Minor surfaces 304C-304F maybe referred to as edges. Major surface 304B serves as a device attach ordevice receiving area. Interconnect structures 306 have opposing majorsurfaces 306A and 306B and minor surfaces 306C, 306D, 306E, and 306F.Surfaces 306C are on one side of semiconductor component 300 andsurfaces 306D are on a side opposite to the side on which surfaces 306Care located. In various implementations in which electrically conductivesupport 302 is a leadframe, device receiving structure 304 may bereferred to as a flag, a die attach paddle, or a die attach pad, andinterconnect structures 306 may be referred to as leadframe leads. Thedistance between major surface 304A and major surface 304B is referredto as a thickness of device receiving structure 304. The distancebetween major surface 306A and major surface 306B may be referred to asthe thickness of leadframe lead 306. Electrically conductive support 302is embedded in a mold compound 310, which mold compound 310 has majorsurfaces 310A and 310B and minor surfaces 310C. In implementations, atleast 20 percent (%) of the thickness of electrically conductive support302 is embedded in mold compound 310. In other implementations, at least50% of the thickness of electrically conductive support 302 is embeddedin mold compound 310. In other implementations, at least 90% of thethickness of electrically conductive support 302 is embedded in moldcompound 310. It should be noted that the amount of material embedded inmold compound 310 should be enough to secure conductive support 302 inmold compound 310. It should further noted that surfaces 304A and 306Aare vertically spaced apart from surface 310A.

FIG. 23 further illustrates a semiconductor chip or die 312 mounted todevice receiving area 304B of die attach paddle 304. More particularly,a die attach material 314 is deposited on device receiving area 304B anda semiconductor chip 312 is positioned on die attach material 314 sothat semiconductor chip 312 is mounted to device receiving area 304B ofdie attach paddle through a die attach material 314.

It should be understood that semiconductor component 300 is a singlecomponent that has been singulated from a molded leadframe strip(described with reference to FIG. 20) using a sawing technique and maybe referred to as outer edges of the interconnect structure. Thus,surfaces 306C of interconnect structures 306 are substantially planarwith corresponding minor surfaces 310C of mold compound 310.

FIG. 24 is an isometric view of semiconductor component 300 shown inFIGS. 22 and 23 at a later stage of manufacture. FIG. 25 is across-sectional view of semiconductor component 300 taken along sectionline 25-25 of FIG. 24. For the sake of clarity, FIGS. 24 and 25 will bedescribed together. A layer of electrically conductive material 320 isformed on the exposed portions of device receiving structure 304 andinterconnect structures 306, i.e., on the exposed portions of surfaces304A and 304C-304F. Electrically conductive material 320 is not formedon the portions of device receiving area 304 and interconnect structures306 within or surrounded by mold compound 310. Electrically conductivelayers 320 are formed using, for example, an electroplating process suchas a spouted bed electroplating process or a vibratory plating process.The spouted bed electroplating process may be performed in a spouted bedelectroplating device and the vibratory plating process may be performedin a vibratory plating device. Electrically conductive material 320 maybe referred to as a spouted bed electroplated material when formed usinga spouted bed electroplating device for its formation or a vibratoryplated material when formed using a vibratory plating device for itsformation. By way of example, the spouted bed electroplated material orthe vibratory plated material may have a thickness at least about 2micrometers (μm) and may be formed on up to one hundred percent of asurface 306C of least one of the interconnect structures 306. Layers 320are further illustrated in FIG. 25, which figure shows that afterplating, layers 320 on surface 306C extend out of the plane formed bysurfaces 306C and 310C.

In various implementations, the material of electrically conductivelayer 320 is tin. The material of electrically conductive layer 320 mayinclude, by non-limiting example, lead; solder; a combination of tin andlead; silver; nickel; a combination of nickel, lead, and gold; or thelike. Similarly, the method for forming electrically conductive layer320 may be any disclosed in this document. Layer of electricallyconductive material 320 may cover or partially cover surfaces 306C-306F.An advantage of forming layer of electrically conductive material 320 isthat it forms a wettable material over edges or surface 306C-306F thatis useful in mounting the semiconductor component in end userapplications.

FIG. 26 is an isometric view of another implementation of asemiconductor component 350 during manufacture. FIG. 27 is across-sectional view of semiconductor component 350 taken along sectionline 27-27 of FIG. 26. For the sake of clarity, FIGS. 26 and 27 will bedescribed together. FIGS. 26 and 27 illustrate a portion of anelectrically conductive support 352 that includes a device or componentreceiving structure 354 and interconnect structures 356 partiallyembedded in a mold compound 360. In various implementations,electrically conductive support 352 is a portion of a leadframe 351 suchas, for example, leadframe 51 described with reference to FIG. 4 that iscoated with an electrically conductive material 355. In otherimplementations, layer of electrically conductive material 355 is formedon leadframe 351 to form electrically conductive support structure 352having device or component receiving structure 354 and interconnectstructures 356. By way of example, electrically conductive layer 355 iselectroplated onto leadframe 351. Suitable materials for electricallyconductive layer 355 include nickel, palladium, gold, or the like.Device receiving structure 354 has opposing major surfaces 354A and 354Band minor surfaces 354C, 354D, 354E, and 354F. Minor surfaces 354C-354Fmay be referred to as edges. Major surface 354B serves as a deviceattach or device receiving area.

Semiconductor component 350 is singulated from a molded leadframe strip(described with reference to FIG. 20) using a sawing technique and maybe referred to as outer edges of the interconnect structure. Thus,surfaces 356C of interconnect structures 356 are substantially planarwith corresponding minor surfaces 360C of mold compound 360. Surfaces356C are on one side of semiconductor component 350 and surfaces 356Dare on a side opposite to the side on which surfaces 356C are located.Because semiconductor component 350 has been singulated from a moldedleadframe strip, surfaces 356C are comprised of the copper of leadframe351 surrounded by electrically conductive layer 355.

Interconnect structures 356 have opposing major surfaces 356A and 356Band minor surfaces 356C, 356D, 356E, and 356F. In those implementationsin which electrically conductive support 352 is a leadframe, devicereceiving structure 354 may be referred to as a flag, die attach paddle,or die attach pad and interconnect structures 356 may be referred to asleadframe leads. The distance between major surface 354A and majorsurface 354B is referred to as a thickness of device receiving structure354. The distance between major surface 356A and major surface 356B maybe referred to as the thickness of leadframe leads 356. Electricallyconductive support 352 is embedded in mold compound 360, which moldcompound 360 has major surfaces 360A and 360B and minor surfaces 360C.In implementations, at least 20 percent (%) of the thickness ofelectrically conductive support 352 is embedded in mold compound 360. Inother implementations, at least 50% of the thickness of electricallyconductive support 352 is embedded in mold compound 360. In particularimplementations, at least 90% of the thickness of electricallyconductive support 352 is embedded in mold compound 360. It should notedthat the amount of material embedded in mold compound 360 should beenough to secure conductive support 352 in mold compound 360. It shouldfurther noted that surfaces 354A and 356A are vertically spaced apartfrom surface 360A.

FIG. 27 further illustrates a semiconductor chip or die 312 mounted todevice receiving area 354B. More particularly, a die attach material 314is deposited on device receiving area 354B and a semiconductor chip 312is positioned on die attach material 314. Semiconductor chip 312 isshown as being mounted to device receiving are 354B through a die attachmaterial 314.

FIG. 28 is an isometric view of semiconductor component 350 shown inFIGS. 24 and 25 at a later stage of manufacture. FIG. 29 is across-sectional view of semiconductor component 350 taken along sectionline 29-29 of FIG. 28. For the sake of clarity, FIGS. 28 and 29 will bedescribed together. A layer of electrically conductive material 370 isformed on the exposed portions of device receiving structure 354 andinterconnect structures 356, i.e., on the exposed portions of surfaces354A and 354C-354F of device receiving structure 354 and on surfaces356A and 356C-356F of interconnect structures 356. Electricallyconductive material 370 is not formed on the portions of devicereceiving area 354 and interconnect structures 356 within or surroundedby mold compound 360. Electrically conductive layers 370 are formedusing, for example, an electroplating process such as a spouted bedelectroplating process or a vibratory plating process. The spouted bedelectroplating process may be performed in a spouted bed electroplatingdevice and the vibratory plating process may be performed in a vibratoryplating device. Electrically conductive material 370 may be referred toas a spouted bed electroplated material when formed using a spouted bedelectroplating device or a vibratory plated material when formed using avibratory plating device. By way of example, the spouted bedelectroplated material or the vibratory plated material may have athickness of at least about 2 μm and may be formed on up to one hundredpercent of a surface 356C of the least one of the interconnectstructures 356. Layers 370 are further illustrated in FIG. 29. Inaccordance with an embodiment, the material of electrically conductivelayer 370 is tin. The material of electrically conductive layer 370 mayinclude, by non-limiting example, lead; solder; a combination of tin andlead; silver; nickel; a combination of nickel, lead, and gold; or thelike. Similarly, the method for forming electrically conductive layer370 may be any disclosed in this document. Layer of electricallyconductive material 370 may cover or partially cover surfaces 356C-356F.An advantage of forming layer of electrically conductive material 370may be that it forms a wettable material over surfaces 356C-356F that isuseful in mounting the semiconductor component in end user applications.

FIG. 30 is an isometric view of another implementation of asemiconductor component 400 during manufacture. FIG. 31 is across-sectional view of semiconductor component 400 taken along sectionline 31-31 of FIG. 30. For the sake of clarity, FIGS. 30 and 31 will bedescribed together. The manufacture of semiconductor component 400 issimilar to that of semiconductor component 300 described with referenceto FIGS. 22 and 23. Accordingly, the description of FIG. 30 continuesfrom the description of FIGS. 22 and 23. A layer of electricallyconductive material 402 is formed over device or component receivingstructure 304 and interconnect structures 306. Electrically conductivematerial 402 may be tin, lead, solder, a combination of tin and lead, orthe like. Electrically conductive material 402 is absent from endsurfaces 306C of interconnect structures 306. Thus, end surfaces 306Care exposed regions of interconnect structures 306. When interconnectstructures 306 are copper, end surfaces 306C are exposed regions ofcopper. By way of example, end surfaces 306C are exposed whensemiconductor components 400 are separated or singulated from aleadframe strip (not shown) using a sawing technique and may be referredto as outer edges of the leadframe lead. Because interconnect structures306 are singulated using a sawing technique, surfaces 306C ofinterconnect structures 306 are substantially planar with correspondingminor surfaces 310C of mold compound 310.

FIG. 31 further illustrates die attach pad or flag 304, leadframe leads306, and electrically conductive layer 402. For the sake ofcompleteness, a semiconductor chip 312 is shown as being mounted toleadframe flag 304B through a die attach material 314.

Referring now to FIG. 32, an electrically conductive material 404 isformed on electrically conductive layer 402 and on end surfaces 306Ausing, for example, an electroplating process such as a spouted bedelectroplating process or a vibratory plating process. The spouted bedelectroplating process may be performed in a spouted bed electroplatingdevice and the vibratory plating process may be performed in a vibratoryplating device. Electrically conductive material 404 may be referred toas vibratory plated material or the spouted bed electroplated materialwhen formed using a vibratory plating device or a spouted bedelectroplating device, respectively, and may be formed on up to onehundred percent of the outer edge of the least one of the plurality ofleads. Layers 404 are further illustrated in FIG. 33. In variousimplementations, the material of electrically conductive layer 404 istin. The material of electrically conductive layer 404 may include, bynon-limiting example, lead; solder; a combination of tin and lead;silver; nickel; a combination of nickel, lead, and gold; or the like.Similarly, the method for forming electrically conductive layer 404 maybe any disclosed in this document. Layer of electrically conductivematerial 404 may cover or partially cover surfaces 306C. An advantage offorming layers of electrically conductive material 404 is that it formsa wettable material over surfaces 306C.

FIG. 33 is a cross-sectional view of semiconductor component 10 takenalong section line 33-33 of FIG. 32. FIG. 33 further illustrates devicereceiving structure 304, interconnect structures 306, and electricallyconductive layers 404. For the sake of completeness, a semiconductorchip 312 is shown as being mounted to device receiving structure 304through a die attach material 314.

FIG. 34 is an isometric view of another implementation of asemiconductor component 450 during manufacture. FIG. 35 is across-sectional view of semiconductor component 450 taken along sectionline 35-35 of FIG. 34. For the sake of clarity, FIGS. 34 and 35 will bedescribed together. FIGS. 34 and 35 illustrate a portion of anelectrically conductive support 452 that includes a device or componentreceiving structure 454 and interconnect structures 456 partiallyembedded in a mold compound 460. In implementations, electricallyconductive support 452 is a portion of a leadframe such as, for example,leadframe 51 described with reference to FIG. 4. Device receivingstructure 454 has opposing major surfaces 454A and 454B and minorsurfaces 454C, 454D, 454E, and 454F. Minor surfaces 454C-454F may bereferred to as edges. Major surface 454B serves as a device attach ordevice receiving area. Interconnect structures 456 have opposing majorsurfaces 456A and 456B and minor surfaces 456C, 456D, 456E, and 456F.Surfaces 456C are on one side of semiconductor component 450 andsurfaces 456D are on a side opposite to the side on which surfaces 456Care located. In implementations in which electrically conductive support452 is a leadframe, device receiving structure 454 may be referred to asa flag, a die attach paddle, or a die attach pad, and interconnectstructures 456 may be referred to as leadframe leads. The distancebetween major surface 454A and major surface 454B is referred to as athickness of device receiving structure 454. The distance between majorsurface 456A and major surface 456B may be referred to as the thicknessof leadframe lead 456. Electrically conductive support 452 is embeddedin a mold compound 460, which mold compound 460 has major surfaces 460Aand 460B and minor surfaces 460C. In implementations, at least 20percent (%) of the thickness of electrically conductive support 452 isembedded in mold compound 460. In other implementations, at least 50% ofthe thickness of electrically conductive support 452 is embedded in moldcompound 460. In particular implementations, at least 90% of thethickness of electrically conductive support 452 is embedded in moldcompound 460. It should be noted that the amount of material embedded inmold compound 460 should be enough to secure conductive support 452 inmold compound 460. It should further noted that surfaces 454A and 456Aare vertically spaced apart from surface 460A.

FIG. 35 further illustrates a semiconductor chip or die 312 mounted todevice receiving area 454B of die attach paddle 454. More particularly,a die attach material 314 is deposited on device receiving area 454B anda semiconductor chip 312 is positioned on die attach material 314 sothat semiconductor chip 312 is mounted to device receiving area 454B ofdie attach paddle through a die attach material 314.

It should be understood that semiconductor component 450 is a singlecomponent that has been singulated from a molded leadframe strip(described with reference to FIG. 20) using a trim technique. A trimtechnique may leave surfaces 456C of leadframes 456 protruding fromcorresponding surfaces 460C of mold compound 460, i.e., surfaces 456C ofleadframe leads 456 are spaced apart from corresponding surfaces 460C ofmold compound 460.

FIG. 36 is an isometric view of semiconductor component 450 shown inFIGS. 34 and 35 at a later stage of manufacture. FIG. 37 is across-sectional view of semiconductor component 450 taken along sectionline 37-37 of FIG. 36. For the sake of clarity, FIGS. 36 and 37 will bedescribed together. A layer of electrically conductive material 470 isformed on the exposed portions of device receiving structure 454 andinterconnect structures 456, i.e., on the exposed portions of surfaces454A and 454C-454F. Electrically conductive material 470 is not formedon the portions of device receiving area 454 and interconnect structures456 within or surrounded by mold compound 460. Electrically conductivelayers 470 are formed using, for example, an electroplating process suchas a spouted bed electroplating process or a vibratory plating process.The spouted bed electroplating process may be performed in a spouted bedelectroplating device and the vibratory plating process may be performedin a vibratory plating device. Electrically conductive material 470 maybe referred to as a spouted bed electroplated material when formed usinga spouted bed electroplating device for its formation or a vibratoryplated material when formed using a vibratory plating device for itsformation. By way of example, the spouted bed electroplated material orthe vibratory plated material may have a thickness at least about 2micrometers (μm) and may be formed on up to one hundred percent of asurface 456C of least one of the interconnect structures 456. Layers 470are further illustrated in FIG. 37, which figure shows that afterplating, layers 470 on surface 456C extend further out of the planeformed by surface 460C.

In implementations, the material of electrically conductive layer 470 istin. The material of electrically conductive layer 470 may include, bynon-limiting example, lead; solder; a combination of tin and lead;silver; nickel; a combination of nickel, lead, and gold; or the like.Similarly, the method for forming electrically conductive layer 470 maybe any disclosed in this document. The layer of electrically conductivematerial 470 may cover or partially cover surfaces 456C-456F. Anadvantage of forming layer of electrically conductive material 470 maybe that it forms a wettable material over edges or surface 456C-456Fthat is useful in mounting the semiconductor component in end userapplications.

FIG. 38 is an isometric view of another implementation of asemiconductor component 500 during manufacture. FIG. 39 is across-sectional view of semiconductor component 500 taken along sectionline 39-39 of FIG. 38. For the sake of clarity, FIGS. 38 and 39 will bedescribed together. FIGS. 38 and 39 illustrate a portion of anelectrically conductive support 502 that includes interconnectstructures 506 partially embedded in a mold compound 510. In variousimplementations, electrically conductive support 502 is a portion of aleadframe that does not include a flag or die attach paddle.Interconnect structures 506 have opposing major surfaces 506A and 506Band minor surfaces 506C and 506D. It should be noted that interconnectstructure 506 has surfaces that are perpendicular to surfaces 506C and506D that are not shown because they are embedded in mold compound 510.In accordance with embodiments in which electrically conductive support502 is a leadframe, interconnect structures 506 may be referred to asleadframe leads. The distance between major surface 506A and majorsurface 506B may be referred to as the thickness of leadframe lead 506.Electrically conductive support 502 is partially embedded in a moldcompound 510, which mold compound 510 has major surfaces 510A and 510Band minor surfaces 510C. Support structures 506 are embedded within moldcompound 510 such that surfaces 506A of support structure 506 are planarwith surface 510A of mold compound 510 and surfaces 506C of supportstructure 506 are planar with surface 510C of mold compound 510. Becausesurfaces 506A are exposed and planar with surface 510A and surfaces 506Care exposed and planar with corresponding surfaces 510C, electricallyconductive support 502 may be considered as being partially embeddedwithin mold compound 510.

FIG. 39 further illustrates a semiconductor chip or die 312 mounted tosupport structures 506. More particularly, a die attach material 314 isdeposited on a surface of a semiconductor chip 312 and semiconductorchip 312 mounted to interconnect structures 506.

It should be understood that semiconductor component 500 is a singlecomponent that has been singulated from a molded leadframe strip(similar to that described with reference to FIG. 20, but without dieattach paddles) using a sawing technique.

FIG. 40 is an isometric view of semiconductor component 500 shown inFIGS. 38 and 39 at a later stage of manufacture. FIG. 41 is across-sectional view of semiconductor component 500 taken along sectionline 41-41 of FIG. 40. For the sake of clarity, FIGS. 40 and 41 will bedescribed together. A layer of electrically conductive material 520 isformed on the exposed portions of interconnect structures 506, i.e., onsurfaces 506A and 506C. Electrically conductive material 520 is notformed on the portions of interconnect structures 506 within orsurrounded by mold compound 520. Electrically conductive layers 520 areformed using, for example, an electroplating process such as a spoutedbed electroplating process or a vibratory plating process. The spoutedbed electroplating process may be performed in a spouted bedelectroplating device and the vibratory plating process may be performedin a vibratory plating device. Electrically conductive material 520 maybe referred to as a spouted bed electroplated material when formed usinga spouted bed electroplating device for its formation or a vibratoryplated material when formed using a vibratory plating device for itsformation. By way of example, the spouted bed electroplated material orthe vibratory plated material may have a thickness at least about 2micrometers (μm) and may be formed on up to one hundred percent of asurfaces 506A and 506C of least one of the interconnect structures 506.Layers 520 are further illustrated in FIG. 41, which figure shows thatafter plating, layers 520 on surfaces 506A extend further out of theplane formed by surface 510A and surfaces 506C extend further out of theplane formed by surface 510C.

In implementations, the material of electrically conductive layer 520 istin. The material of electrically conductive layer 520 may include, bynon-limiting example, lead; solder; a combination of tin and lead;silver; nickel; a combination of nickel, lead, and gold; or the like.Similarly, the method for forming electrically conductive layer 520 maybe any disclosed in this document. Layer of electrically conductivematerial 520 may cover or partially cover surfaces 506A and 506C. Anadvantage of forming layer of electrically conductive material 520 isthat it may form a wettable material over edges or surface 506A and 506Cthat is useful in mounting the semiconductor component in end userapplications.

FIG. 42 is an isometric view of another implementation of asemiconductor component 550 during manufacture in accordance withanother embodiment of the present invention. FIG. 43 is across-sectional view of semiconductor component 550 taken along sectionline 43-43 of FIG. 42. For the sake of clarity, FIGS. 42 and 43 will bedescribed together. FIGS. 42 and 43 are similar to FIGS. 40 and 41,respectively, except that semiconductor die 312 is mounted to electricalinterconnects 506 using a flip-chip technique. Thus, bond pads 315 thatare formed on a surface of semiconductor die 312 are mounted tocorresponding electrical interconnects 506 using die attach material314A. Externally, semiconductor component 550 looks the same assemiconductor component 500.

In various implementations the electrically conductive support structuremay be a flagless structure.

Referring to FIG. 44A, an implementation of an encapsulated leadframe600 is illustrated. The leadframe 600, like those disclosed in thisdocument, contains leadframe leads (leads) 602 and a leadframe flag(flag) to which a die 610 (or any other electrical component disclosedherein) is coupled. Electrical connectors 608 electrically connect thedie 610 to the leads 602. Mold compound 612 (which may be any disclosedherein) encapsulates the die 610 and the leadframe except for the leads602 and the flag. Tie bars 604 couple the leads 602 to the flag. Asillustrated, the tie bars 604 are half etched, i.e., the thickness ofthe tie bars 604 has been etched/sawn partially through prior to bepartially encapsulated in the mold compound 612. The exposed surface ofthe leads 602, the tie bars 604, and the flag have been coated with anelectrically conductive layer 606 which coating may include any materialdisclosed herein, and be performed using any technique disclosed herein.

Following coating of the leads 602, tie bars 604, and the flag with theelectrically conductive layer 606, the tie bars 604 are fullyelectrically and physically singulated. As the diagram of the saw bladeabove FIG. 44A indicates, the width of the tie bar between the leads 602and the flag may be sized to match or substantially correspond with thewidth of the saw blade. While a saw blade is illustrated, thesingulation in various implementations can be performed using, bynon-limiting example, laser scribing, high pressure water jet cutting,masking and etching processes, and other techniques for cutting themetal and surrounding mold compound including any disclosed in thisdocument.

FIG. 44B illustrates the leadframe of FIG. 44A following the singulationprocess. As can be seen, the material from the electrically conductivelayer fully extends along the end 614 of the lead 602. This behavior maybe referred to as creating a “wettable flank” for the lead, as itpermits a solder fillet to be placed on the lead end side of thesemiconductor package when the package is mounted. Having theelectrically conductive material extend fully along the end may also bereferred to as 100% coverage of the ends, which may be desirable inspecific industries, such as automotive applications. Because the leadsmay need to be connected to the leadframe during electroplating (ifelectroplating is used to coat the leads 602 with the electricallyconductive layer), the tie bars 604 are used to establish an electricalconnection during the process and then are removed by being singulated.

Referring to FIG. 45A, a top view of a leadframe 620 encapsulated withmold compound 626 is illustrated showing leads 622 and tie bars 628, 630that couple the leads with the flag 624. FIG. 45B shows a cross-sectionof the leadframe 620 taken along sectional line A-A. Here, the tie bar630 is a full thickness tie bar. FIG. 45C shows the structure of thelead frame after the tie bars 630 have been removed leaving gap 632between the flag 624 and the leads 622. FIG. 46A illustrates the topview of the leadframe 620 following singulation of the tie bars usingany of the methods disclosed herein. FIG. 46B shows a similarcross-section view of a tie bar 634 that is half etched. As can be seen,the gap in the tie bar 634 is oriented toward the mold compound and themold compound fills the gap. In other implementations, however, likethose disclosed herein, the gap in the tie bar 634 may be oriented awayfrom the mold compound. FIG. 46C shows the leadframe of FIG. 46Bfollowing singulation using any of the methods disclosed herein. Fromthe top view, provided the pattern of the leadframe leads and flag isthe same, the half etched version of the leadframe will look the same asthe full thickness version following singulation of the tie bars.

Referring to FIG. 47, an implementation of a leadframe 636 isillustrated. This leadframe 636 contains multiple leadframes formultiple semiconductor packages and has been processed through the stepsof coupling a semiconductor die and/or an electronic component to theleadframe and encapsulating with mold compound 652. While the leadframein FIG. 47 has multiple flags 648, in others, there may be no flags oronly some flags. As can be seen, the leads 640 of the leadframe 636 arecoupled together (except for those at the edges 638 of the frame) andare coupled to the flag 648 through tie bars 646. Half etched portions650 may be present between adjacent die flags 648 in variousimplementations.

Referring to FIG. 48, the leadframe implementation of FIG. 47 isillustrated following fully electrically and physically singulating theleads 640 of the leadframe that are joined together in the columns ofthe leadframe. At this point, the electrical connection to the lead 640is through the tie bars 644 and the respective die flag 648 to which theleads 640 are coupled. This singulation may be done using any of thesingulation processes disclosed in this document.

Referring to FIG. 49, the leadframe of FIG. 47 is illustrated followingcoating of the leads 640 (and tie bars 644 and flag 648) with anelectrically conductive layer (material) and then fully electrically andphysically singulating the tie bars 644 between the leads 640 of theleadframe and the leadframe flag 648. This electrically conductivematerial may be any disclosed herein. At this point, the mold compound652 is exposed between the leads 640 and the flags 648. FIG. 50illustrates the leadframe when the individual packages in the leadframehave been singulated from each other to form semiconductor packages andthe edges of the leadframe has been removed as well. Each of thepackages 654, 656 has its own set of leads 640 electrically coupled tothe flag 648 via connectors within the packages like those disclosedherein.

Referring to FIGS. 51A and 51B, two different leadframe designs areillustrated. In both designs, however, the leads 681, 670 are arrangedaround the flags 664, 674 in such a way that the tie bars 660, 666cannot be singulated using a straight line across the leadframes in bothX and Y directions without cutting through some of the leads 681, 670.In contrast, the leadframe design illustrated in FIG. 52 is designed sothat the tie bars 678 can be cut straight through in the X and Ydirections without cutting through the leads 676. FIG. 53A illustratesthe leadframe implementation of FIG. 51A with the tie bars removed asindicated by rectangle 682 and FIG. 53B shows a similar rectangle 684.The removal area allows the pads 681 and 670 to be electrically isolatedfrom the flag regions. For these implementations, the removal is doneusing a technique that can be applied to each individual leadframe orgroup of leadframes at a time, such as laser scribing, masking andetching, and the like. FIG. 54 shows the rectangular pattern 686 on theleadframe of FIG. 52. This figure shows how the configuration of FIG. 52can be singulated using all of sawing, high pressure water jet cutting,laser scribing, and other techniques that use clear X and Y directionpaths for cutting the tie bars from the leads 676.

Referring to FIGS. 55A and 55B, two different encapsulated leadframedesigns are illustrated showing tie bars 682 that link individual leadstogether, but which do not couple the leads to the flag of theleadframe. In these implementations, the electrical connection neededfor coating with an electrically conductive material is formed notthrough coupling with the flag but through other structures coupled tothe leads/tiebars 682 themselves (assuming the method of coatingrequires electrical current). In these two leadframes, the distancebetween the leads and the tie bars 682, 684 is a single predeterminedwidth. In various implementations, because the tie bars 682, 684 allfall within the predetermined width, one single width cut can be used tosimultaneously singulate all the tie bars of the leadframe. This maysimplify processing and improve run rates.

Referring to FIG. 59, 60A, and as discussed previously, the tie bars 696may be half etched and face away from the mold compound, or they may bepartially physically singulated before the leads 692 and tie bars 696are coated with the electrical conductive material 698 (see FIG. 60B).The singulation of the tie bars 696 may take place using any singulationprocess disclosed in this document. Following coating, full singulationof the tie bars 696 takes place, and, as can be seen in FIG. 61, theresulting structure has a full coating of electrically conductivematerial on the end (flank) of the leads 692 and a partial coating oneither side of the trench 700 where the partially singulated or halfetched tie bars 696 had been. In various implementations, having theelectrically conductive material down in the trench 700 as well as onthe flank end of the leads 692 may further assist with improvingwettability and adhesion during the packaging bonding process.

Referring to FIG. 56, a side view of an implementation of anencapsulated leadframe 686 is illustrated. The leadframe 686 has an edge688 which is electrically conductive and can be used during anelectrodeposition process to apply electrically conductive material tothe leadframe. In various processing operations, including thosedisclosed herein that involve singulation and partial singulation ofvarious components, including tie bars, the edge of the leadframe mayalso be cut or singulated, which may reduce/hamper or eliminate theability of the edge to properly serve as an electrical conductor.Accordingly, referring to FIG. 57, the edge 688 is shown after havingbeen deflected toward the encapsulation material thus placing it out ofthe location where it can be singulated. One or more edges may be bentthrough deflection, and the deflection can take place toward or awayfrom the encapsulation material in various implementations. FIG. 58illustrates how the edge 688 of the leadframe 686 may be bent through aformed bending operation to form a stepped bend in the edge 688. In thisway, the outside edge of the edge 688 is further placed out of the pathof a singulation tool (such as a saw, for example). A wide variety ofpossibilities and combination of bends made by deflection, formedbending, etc. may be used by those of ordinary skill using theprinciples disclosed herein. In various implementations, the bending ofthe edge 688 takes place prior to fully and electrically singulating theone or more tie bars. In other implementations, the bending could takeplace before other singulation operations, including partialsingulation, however.

In places where the description above refers to particularimplementations of semiconductor packages and related methods andimplementing components, sub-components, methods and sub-methods, itshould be readily apparent that a number of modifications may be madewithout departing from the spirit thereof and that theseimplementations, implementing components, sub-components, methods andsub-methods may be applied to other semiconductor packages and relatedmethods.

What is claimed:
 1. A method of forming a semiconductor device,comprising: providing a leadframe; disposing an electronic component ona flag of the leadframe; depositing an encapsulant over the electroniccomponent; forming a trench fully through a lead of the leadframe;forming a conductive layer in the trench over an entire height of asidewall of the lead; and singulating the leadframe through the trench.2. The method of claim 1, wherein the trench extends to the encapsulant.3. The method of claim 1, further including forming a dimple in thelead.
 4. The method of claim 1, further including: forming a bond wireextending from the lead; and forming the trench under the bond wire. 5.The method of claim 1, further including singulating a tie barconnecting the flag to the lead after forming the conductive layer andbefore singulating the leadframe through the trench.
 6. The method ofclaim 1, wherein the entire height of the sidewall of the lead extendsfor an entire height of the lead.
 7. A method of forming a semiconductordevice, comprising: providing a leadframe; providing an electroniccomponent; depositing an encapsulant over the leadframe coupled to theelectronic component; forming a trench fully through a lead of theleadframe; forming a conductive layer entirely covering a sidewall ofthe lead in the trench; and singulating the leadframe through thetrench.
 8. The method of claim 7, further including: disposing theelectronic component on a flag of the leadframe; and singulating throughan extension of the flag after forming the conductive layer.
 9. Themethod of claim 7, wherein forming the trench removes a portion of theencapsulant.
 10. The method of claim 7, further including forming thetrench through a tie bar of the leadframe.
 11. The method of claim 10,further including forming a dimple in the tie bar.
 12. The method ofclaim 7, further including: forming a bond wire extending from the lead;and forming the trench under the bond wire.
 13. The method of claim 7,further including forming the conductive layer over an entire height ofthe lead.